China's 3nm chip; state of the industry supply chain; imec's next big push;; hyper-dimensional AI chip; OpenAI's $6.5B ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Quickly screen large amounts of possible materials for specific properties and select promising candidates for deeper ...

Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.

A technical paper titled “Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors” was ...

When the via impedance value cannot be determined, evaluating the signal transmission provides a viable alternative.

Determining the ideal etch conditions to remove rough areas of the line and space resist pattern after EUV exposure.

Confidential Computing for Embedded RISC-V Systems” was published by researchers at IBM Research, IBM T.J. Watson Research ...

The switch to transformer models has increased AI-driven computing demand by a factor of 50 million over five years.

Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the ...

Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to ...