Abstract: In this article, an efficient Laguerre-based alternating direction implicit (LB-ADI) approach is proposed for the transient thermal simulation of integrated chiplets and packages. The ...
Abstract: An advanced multiphysics numerical methodology is introduced for simulating satellite phased array antennas, encompassing thermal, mechanical, and electromagnetic aspects. The finite element ...
This project implements Monte Carlo simulations for studying thermal phase transitions using PyTorch. It leverages CUDA acceleration, a checkerboard (alternating) Metropolis update scheme, and ...
A MATLAB-based simulation of thermal fields and melt pool dynamics during Laser Powder Bed Fusion (L-PBF) of Inconel 625. Includes transient thermal analysis, Gaussian heat source modeling, and ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Bond EP5TC-80 is a NASA low outgassing rated epoxy ...
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