Abstract: We have developed the novel structure of Cu-Cu hybrid bonding called “Cu-Cu wiring”. The Cu-Cu wirings have been formed through hybrid bonding of Cu lines. The new CMP process has been ...

Abstract: Ball grid arrays (BGAs) and bonding wires (BW) are widely used in electronic packages, which may result in the impedance discontinuity. In this work, an optimization strategy, using the ...

John Lewis has turned to a surly teenager giving his father the Christmas gift of a memory-laden ’90s vinyl for its highly anticipated festive campaign. It is the first time the department store has ...

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During structure relaxation, these structures are refined to identify the most stable configurations using energy minimization. However, random structure generation often produces several low-density ...