Earlier this week, Synopsys announced a broadened collaboration with TSMC, highlighting certification of its Ansys simulation ...

Synopsys and TSMC have partnered to accelerate the development of next-generation AI chips and multi-die designs.

AI-driven electronic design automation (EDA) and broad IP solutions from Synopsys enable differentiated designs on the TSMC ...

Ansys RedHawk-SC and Ansys Totem power integrity platforms are certified for the latest TSMC N3C, N3P, N2P, and A16 process ...

Synopsys announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP ...

Chip design firms are increasingly relying on AI-powered software from providers such as Cadence and Synopsys.

Last year, Cadence collaborated with TSMC to improve efficiency and performance in AI-driven advanced-node designs and 3D-ICs ...

At a conference in Silicon Valley, Taiwan Semiconductor Manufacturing Co, the contract manufacturer that fabricates chips for ...

The EDA trio—Cadence Design Systems, Siemens EDA, and Synopsys—is working closely with TSMC to facilitate AI-driven circuit and system designs, as well as accelerate multi-die innovations, making ...

Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading contract chipmaker, has revealed a bold new approach ...

Tenfold efficiency claim TSMC said that AI-driven design tools have lifted its AI chip energy efficiency by about ten times. The foundry told the gathered throngs at its open innovation platform event ...

Collaboration with Cadence and Synopsys aims to accelerate design while reducing power use in data center chips | ...