Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Evaluating appropriate chemistries to remove WS Flux ...

The global advanced IC substrates market size is expected to reach USD 42.62 billion by 2034, according to a new study by Polaris Market Research. The report "Advanced IC ...

ACM Research, Inc. announced the launch of its first Ultra Lith KrF track system, designed to support front-end semiconductor manufacturing. The new system ...

KYZEN is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona. Attendees are invited ... KYZEN is pleased to ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

As fiscal year 2025/26 begins, Carl Zeiss AG is reorganizing its Executive Board under President and CEO Andreas Pecher. Dr. Jochen Peter, responsible for the ZEISS IQR ... ZEISS is honored to ...

EV Group (EVG) announced the promotion of Cindy (Yu-Ying) Lee to general manager of EV Group Taiwan Ltd., EVG's fully owned subsidiary in Taiwan. Lee assumes this leadership ... EV Group (EVG) ...

SEMI announced its new Conductor™ intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as part of the SEMI Supply ... SEMI announced the ...

ASMPT announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions). Gordon joined ASMPT in August with ... ASMPT Limited (ASMPT) announced its ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The BT-1 high capacity plasma systems features 5 ...

Akrometrix, LLC recently announced the next generation in thermal warpage metrology with its PS600T system. This system greatly improves temperature uniformity ... Professor Ifeanyi Charles Ume ...