EnSilica, a maker of mixed signal ASICs, has announced that it has established a new engineering hub in Cambridge, UK.

Rhopoint Components is now stocking the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module.

Research suggests that the rapid growth in XR content consumption is set to put a major strain on existing networks.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

NXP Semiconductors announces the NTAG X DNA, a new Type 4 secure connected NFC tag, enabling secure authentication.

SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.