DFT’s mission is to enable a consistent way of testing chips post-manufacturing. But with an HBM stack, it also needs to ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Chip security must be designed in from the start, with clear requirements that connect architecture, verification, software, manufacturing, and field deployment. AI is expanding both the scale and ...

NASA’s lunar network will leverage Delay/Disruption Tolerant Networking to maintain signal integrity between rovers, astronauts, satellites, and more. 4G/5G LTE RF and optical inter-satellite links ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.