HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed ...

Today’s most advanced AI systems rely on larger, more complex assemblies of dies and chiplets from multiple process nodes and foundries, driving unprecedented demands on advanced packaging. At the ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

Implementing the Cyber Resilience Act: Practical Guidance for Security Engineering and Compliance is a practical eBook designed to help product manufacturers, security teams, compliance leaders, and ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...