Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs ...

Co-located with the first ever Sustainable Manufacturing Expo, WestPack features the new FuturePack Forum, exploring state ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Thermal challenges in 5G radios and the combination of passive and active thermal management techniques and hardware design ...

providing tools to optimize supply chain operations and boost business growth. "WestPack is known for showcasing the transformative power of packaging advancement over decades of expertise and ...

Great design is more than aesthetics—it shapes the way we live, interact, and experience the world. The European Product ...

Higher system costs due to packaging ... to low power design techniques [3]: Each step in the DFT insertion process must be made power aware; Additional work has to be done in order to test the power ...

Semiconductor Packaging Market 2030 Semiconductor Packaging Market Expected to Reach $60.44 Billion by 2030 IoT products like senso ...

From conferences to workshops to expo floor education, MD&M West has an educational agenda with something for all.

There was once a time when only well-established industry heavyweights could design and build bleeding-edge chips. That is no ...