In a rare interview, TSMC founder Morris Chang revealed what it was like to bet the chipmaker's future on a deal to make iPhone chips for Apple.

Summer jobs in semiconductor technology. The growth of the semiconductor sector and its investments in Finland are increasing the need for new skilled personnel.

In addition to the announced federal funding terms announced, the $172 million project will be supported by an expected $15.7 ...

Chip companies have criticized the policy as hastily drawn up and potentially damaging to the industry. Because the proposed framework includes a 120-day comment period, the incoming Republican ...

allegations that the US dumps lower-end chips and unfairly subsidizes its own chipmakers, in potentially one of Beijing’s strongest retaliatory moves against American technology sanctions.

The Biden administration rolled out a flurry of new restrictions on Chinese companies and their access to advanced chips, part of a last-gasp clampdown on the adversary’s ability to harness ...

Marvell highlights India's semiconductor growth ahead of VLSI conference Marvell reports strong 3Q24 results, driven by AI silicon demand High-end Ethernet chip demand for AI data centers picking up ...

The U.S.'s ability to pick winners and losers stems from the EU’s heavy reliance on AI chips from U.S.-based companies, such as world-leading chip designer Nvidia. These tiny bits of technology power ...

The rise of Nvidia has spurred renewed investor interest in AI chip startups. One of them, Blaize, founded by former Intel engineers, is set to go public on the Nasdaq in a SPAC deal on Tuesday ...

And so, with just a week until Trump’s return to the White House, the Biden Administration added finishing touches to its existing chip sanctions. The new rules attempt to make it even harder ...

The Biden administration has issued new restrictions on the export of US-developed computer chips that power artificial intelligence (AI) systems, in a final effort to prevent rivals like China ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...