Construction of the Eugene Sayan Visitor Center at Tesla Science Center starts in June, marking a significant step in ...

So, in other words, this kernel change – the requirement for CMPXCHG8B – removes support for processors older than the ...

The discrete version of Intel's upcoming Arc Xe3-based GPU line, Celestial, took a larger step towards full production as pre-silicon validation began. However, so much has changed for Intel as of ...

Intel Corp. confirmed that initial production test runs for its most advanced silicon wafer, the 18A, are underway at its Arizona semiconductor plant with plans to ramp up to full volume ...

Screenshots shared by a user on X (formerly known as Twitter) also show that Intel has already made pre-silicon mockups for the Xe3 graphics card, which serves as the base for the Arc Celestial.

Intel Corp. late Thursday unveiled a turnaround plan that aims to return it to its engineering roots, the first major action under new Chief Executive Lip-Bu Tan, but its stock tumbled on its ...

Intel 14A will be powered by ASML’s High NA EUV lithography machines. The most advanced lithography equipment used in production today etches transistors into silicon wafers with a resolution of ...

Intel said Tuesday that the company’s Arizona fab has run the first lots of the company’s Intel 18A wafers, the manufacturing technology powering its Panther Lake chips, while announcing a ...

Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry, said: “Our collaboration with Keysight EDA on EMIB-T silicon bridge technology is a pivotal step in advancing high-performance ...

Intel's oddball Core Ultra 200V laptop chips—codenamed Lunar Lake—will apparently be a one-off experiment, not to be replicated in future Intel laptop chips. They're Intel's only processors ...

As an advanced, system-level chiplet design and die-to-die (D2D) design solution, Chiplet PHY Designer enables pre-silicon level validation, streamlining the path to tapeout. Suk Lee, VP & GM of ...

Supports latest interconnect standards, including Universal Chiplet Interconnect Express™ 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight’s EDA ...