ROHM leverages its LogiCoA technology to control a power-factor-correction stage and flyback DC-DC converter stage at the same time.

This FAQ examines how stray inductances in components and PCB layouts create voltage overshoots, electromagnetic interference ...

As data center energy consumption surges due to AI and cloud growth, onsite power generation emerges as a key strategy, but ...

Using intelligent analog peripherals in an MCU as a way to handle signals that require some conditioning but aren’t particularly sensitive.

Toshiba Electronics has released three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation ...

The dense metallization required for backside power networks blocks traditional failure analysis techniques. As leading semiconductor companies prepare to deploy BPD in production, debug teams must ...

A new light-based method lets tiny quantum dots release perfectly controlled photons, opening doors to faster and cheaper ...

NXP has launched the MCX A34 mixed-signal Arm Cortex-M33 industrial MCU, an upgrade of the MCX A14x and MCX A15x MCUs, which were introduced in 2024.

A simple extension of a previous class A/B differential output amp DI that creates a square-law characteristic.

Toshiba has released three new 650V SiC MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and ...

Toshiba has launched three 650V SiC MOSFETs equipped with its latest 3rd generation SiC MOSFET chips and housed in surface-mount TOLL packages. The devices are suitable for industrial equipment, such ...

The global circulation of water is a little like the distribution of power on the board. There is a source and an endpoint, but it’s a closed system. Tributaries may diverge or converge to provide ...