This work presents a novel aluminum honeycomb structure with frequency-selective properties. The proposed frequency selective surface (FSS) is formed by loading metal surfaces with a Y-slot on the top ...

Through-silicon-vias (TSVs) are prone to defects during the manufacturing process, which pose yield challenges for three dimensional integrated circuits (3D-ICs). The area per TSV is too great to be ...

Researchers from Swiss and Austrian institutions have demonstrated a novel design for a glass-free, structurally robust silicon PV module. With a weight below 6 kg/m2, the targeted application is ...