As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) ... Siemens Digital Industries ...
Aehr Test Systems announced it has received follow-on orders from its lead production artificial intelligence (AI) processor customer for package part burn-in for eight Sonoma ... Semiconductor ...
Yole Group announces its latest market and technology analysis: Status of the Memory Industry Report 2025. This new edition highlights the resurgence of the memory ...
Learn how to perform an optimal Cold Bump Pull test on solder balls using tweezers. This guide covers test method settings and failures modes for CBP all types of bump testing. Feel free to move ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Many do one or the other — we do both. Quality, ...
Heidelberg Instruments has received a substantial order from a top-tier photomask manufacturer in Asia for a VPG+ 1850 FPD system, developed on the established platform ... Semiconductor Packaging ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Yole Group is proud to announce the release of the first edition of its Status of the Back-End Equipment Industry 2025 report. This new publication offers an unprecedented ... Semiconductor Packaging ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
The silicon photonics industry is entering a period of rapid growth and diversification, according to Yole Group's new report, Silicon Photonics 2025 – Focus on SOI, SiN, LNOI ... Semiconductor ...
Resonac Corporation unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and ...