Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Evaluating appropriate chemistries to remove WS Flux ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Heidelberg Instruments has received a substantial order from a top-tier photomask manufacturer in Asia for a VPG+ 1850 FPD system, developed on the established platform ... Semiconductor Packaging ...

CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator ... Semiconductor ...

Aehr Test Systems announced it has received follow-on orders from its lead production artificial intelligence (AI) processor customer for package part burn-in for eight Sonoma ... Semiconductor ...

WIN Semiconductors Corp announces the launch of its NP12-1B, a groundbreaking 0.12 μm gate-length depletion-mode (D-mode) Gallium Nitride (GaN) High Electron Mobility ...

itachi High-Tech Corporation announced the launch of its GT2000 high-precision electron beam metrology system. GT2000 uses Hitachi High-Tech's technology and expertise ... Hitachi High-Tech ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Evaluating appropriate chemistries to remove WS Flux ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Many do one or the other — we do both. Quality, ...

Resonac Corporation unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and ...

Beijing NAURA Microelectronics Equipment Co.,Ltd. and Akrion Systems LLC jointly announced that the previously announced acquisition by NAURA has been completed ...