China’s reported move towards domestic production of immersion deep-ultraviolet (DUV) lithography systems represents a ...

Emerson has introduced new artificial intelligence (AI) enhancements to its NI software portfolio. By expanding the capabilities of its Nigel AI platform, it now includes code generation, and ...

Researchers at The University of Warwick and Canada’s NRC have proposed a new approach to quantum chip design.

Samsung and Broadcom agree to expand their collaboration across memory, foundry and advanced packaging technologies.

The evolution of lighting in the smart home is being driven by greater connectivity, AI and human centric design.

GLF1800 Series of ideal diodes, designed to improve power-path protection and energy efficiency in battery devices.

Cadence certifies AI-driven 18A-P and 14A process design flows Credit: adobe.stock.com Cadence has announced that its ...

Astute Group signs franchise agreement with UTA Wireless, expanding its portfolio of cellular connectivity products.

Industry consolidation renews debate about transparency, independence and governance across the component supply chain.

TE Connectivity has entered into an agreement to acquire Astrodyne TDI, a US-based provider of advanced power management and ...

The sensor combines flow and temperature measurement within a single device, providing real-time monitoring for liquid ...