International shipping has almost come to a halt at the entrance of the Strait of Hormuz. Last Sunday, German ⁠shipping group Hapag-Lloyd said it had suspended all ⁠vessel transit through the strait ...

Open Cosmos has announced its layered satellite architecture, ConnectedCosmos, for resilient Ka-band communications. The dedicated connectivity infrastructure enables a combination of norrowband and ...

Intel has appointed Craig Barratt (pictured) to be its next chairman, taking over from Frank Yeary who became chairman in ...

Thales’ SGP.32 eSIM technology is designed for massive IoT deployments, supporting simplified remote provisioning and large-scale device management, while SGP.22 suits consumer and hybrid use cases ...

Micron is sampling a 256GB LPDRAM module — 256GB SOCAMM2 – based on a 32Gb LPDDR5X die.

Ayar Labs, the co-packaged optics (CPO) specialist, has raised $500 million in Series E funding. The company will use the funds to scale high-volume production and test capacity to accelerate ...

At MWC in Barcelona (2-5 March), Quectel Wireless Solutions launched the FGH200M long range, low power module. It is based on ...

Skyworks and Mediatek have produced a reference design of a 6G FR3 frequency range RF front-end (RFFE) power amplifier. The ...

Imec’s NanoIC pilot line has brought out two PDKs for sub-2nm processes: a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced ...

ASML is looking at expanding from front-end litho into packaging, according to CTO Marco Pieters (pictured).

Nvidia has hooked up with Booz Allen, BT, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank and T-Mobile — to build 6G networks on AI-native, open, ...

Read the first ever Electronics Weekly online: 7th September 1960. We've scanned the very first edition so you can enjoy it. The hyperscalers talk about spending $600 billion on datacentres this year ...