Fourth quarter revenue of more than $2.4 billion, above the midpoint of guidance with sequential growth across all end markets Fiscal 2024 revenue of more than $9.4 billion Fiscal 2024 operating cash ...

The ADL8154-EVALZ is a 4-layer printed circuit board (PCB) fabricated from a 10 mil thick (0.25 mm) Rogers 4350B and Isola 370HR copper clad, forming a nominal thickness of 62 mils (1.57 mm). The RFIN ...

Today’s designs require an increasing number of power rails and supply solutions in electronics systems, with loads ranging from a few mA for standby supplies to over 100A for ASIC voltage regulators.

Serial peripheral interface (SPI) is one of the most widely used interfaces between microcontroller and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. This article ...

Q: ADI has published a lot of information on dealing with capacitive loading and other stability issues in books, such as the amplifier seminar series, in earlier issues of Analog Dialogue, and in ...

High-availability systems, such as servers, network switches, redundant-array-of-independent-disk (RAID) storage, and other forms of communications infrastructure, need to be designed for near-zero ...

Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling ...

One common method for determining the tilt or inclination of a system is to integrate the output of a gyroscope. Although this method is straightforward, error ...

This application note presents the electrical aspect of the 1-Wire protocol for new and legacy devices. A special section explains how to determine appropriate timing parameters for a network ...

Op amps are very high gain amplifiers with differential inputs and single-ended outputs. They are often used in high precision analog circuits, so it is important to measure their performance ...

A source measure unit (SMU) is an instrument that combines a sourcing function and a measurement function on the same pin or connector. It can source voltage or current and simultaneously measure ...

This application note provides design and manufacturing guidance in the use of the lead frame chip scale package (LFCSP). The LFCSP is compliant with JEDEC MO220 and MO229 outlines. The LFCSP is a ...