The complexity of DRC rules increases with shrinking geometries. It is not that the laws of physics change with shrinking IC feature size; they are just more strictly enforced. At one time, there was ...

Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...

The whole is more than the sum of its parts. –Aristotle A machine is nothing more than a collection of nuts, bolts, wheels, gears, wires, pipes, chains, and what have you. And yet, when they are all ...

Every IC designer strives to create a “clean,” or error-free, cell, block, chiplet, SoC, or 3DIC assembly before passing their work downstream for full sign-off verification. However, waiting until ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.