Samsung's next-generation 300-layer NAND flash will purportedly be produced differently from SK hynix. It will use a "double-stack" technique, which involves placing one 3D NAND stack on a 300 mm ...

Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...

SK Hynix is shutting down its CMOS image sensor (CIS) business, fueling industry speculation over whether Samsung Electronics will follow suit. Samsung's system LSI division, which... SK Hynix Inc ...

Another 3D NAND vendor, SK Hynix, plans to move into pilot production later this year. As previously stated, the SanDisk/Toshiba duo won’t ship 3D NAND until 2016. Meanwhile, Spansion and China’s XMC ...

“The acquisition of Intel’s 3D NAND Flash capacity will massively elevate SK Hynix’s competitiveness in the enterprise SSD market,” the firm said. “Going forward, it remains to be seen ...

It focuses on 3D NAND flash memory, a critical component in ... semiconductor corporations such as Samsung Electronics and SK Hynix in terms of market share, it is quickly catching up with South ...

Samsungs memory chip leadership at risk as Chinas CXMT, YMTC close in Samsung Electronics forced to revise strategy as Chinese rivals advance at breakneck speed ...

Advancements in 3D NAND have pushed chip designs beyond 200 layers, with companies like Micron, SK Hynix, and Samsung already eyeing 400-layer technology to increase storage density. However ...

SEOUL: South Korea’s SK Hynix Inc says it has completed the first phase of its acquisition of Intel Corp’s NAND flash memory chip business, after it received regulatory nods from eight ...

Intel is reportedly close to reaching a deal to sell its NAND memory business for roughly $10 billion to South Korean chipmaker SK Hynix ... that produces 3D NAND products. The 3D XPoint ...