Intel, Samsung, and TSMC will collaborate on 450mm silicon wafers; once chip companies have made the move, users should start to see higher-performing chips at lower prices Chip makers Intel, Samsung ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
The government will prioritise proposals for silicon carbide (SiC)-based wafer manufacturing under the second version of the India Semiconductor Mission (ISM), officials said. The electronics and ...
Mr. Proud, who became a U.S. citizen in 2019, put together a policy paper for the first Trump administration, calling for a ...
MUMBAI, June 23 (Reuters) - Yash Birla Group said on Thursday group firm Birla Surya Ltd will invest 54 billion rupees over five years to set up an integrated facility for fabrication of ...
Global silicon wafer shipments are set to grow about 5.4% in 2025 to 12,824 million square inches (MSI), according to new ...
NorSun’s CEO also called for further policy measures to be undertaken to regulate the US market. Image: NorSun. Norwegian ingot and wafer manufacturer NorSun will supply Heliene, a Canadian solar PV ...
A Michigan manufacturer of silicon carbide (SiC) wafers, a key component in EV power electronics, just got a big loan from the US Department of Energy to ramp up production. SK Siltron CSS announced ...
Imec, perhaps the world's top semiconductor research center, has created the first monolithic III-V CMOS transistors on 300mm silicon wafers. With current silicon-based transistors hitting a wall at ...
Chip makers Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced Monday that they will collaborate to move chip manufacturing onto larger silicon wafers by 2012. The move to ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback