Renesas announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process at the ISSCC 2026.
The 3nm building blocks include high-speed SerDes and parallel interconnects for dramatically boosting the performance of next-generation data infrastructure Innovative die-to-die interconnects will ...
Renesas Electronics has announced a new ternary content‑addressable memory (TCAM) technology built on a 3nm FinFET process.
TAIPEI, Oct. 13, 2025 /PRNewswire/ -- InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will ...
TSMC has unveiled plans to produce 3-nanometre semiconductors in Japan, as the world’s largest chip manufacturer diversifies ...
Apple feels the heat - significantly reduces its advanced chip order with TSMC. The 3nm chip will be very expensive. TSMC is one of the major players in the chip foundry business. The Taiwanese ...
Apple’s M5 MacBook Pro, powered by the innovative M5 chip, establishes a new standard for high-performance laptops. Built using advanced 3nm process technology, the M5 chip introduces substantial ...
Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P node, underscoring a trade-off between performance, cost, and ...
TL;DR: Samsung announced mass production of its 2nm GAA process, offering 5% faster performance, 8% better power efficiency, and 5% more area than its 3nm node. This advancement aims to enhance ...
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