Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding the timetable for ...
The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking ...
Multi-protocol subsystem IP provides 8 Tbps/mm bandwidth density with D2D data rate of 24 Gbps for hyperscaler, high performance computing (HPC) and AI applications LONDON & TORONTO--(BUSINESS ...
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